Manuel d'utilisation / d'entretien du produit MSB900 du fabricant Compaq
Aller à la page of 66
Detailed Technica l USER M ANU A L FOR: 3.5”-SBC MSB900/L Nordstrasse 11/F CH- 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 2 For internal use only: File: MSB900_Detailed_ V1.0 Path: R:HANDBUCHMS BMSB900MS B900_Detailed_V1.0 .doc COPYRIGHT 2008 BY DIGITA L-LOGIC A G This publication is protecte d b y cop yright and all rights are reserved.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 3 Table of Contents 1. Preface ....................................................................................................................... 5 1.1. T radema rks ....................
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 4 5.6.3. W atchdog ..................................... .................................. .................................. .......................... 28 5.6.4. ROM-BIOS Sockets ..........
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 5 1. P REF A CE The inf ormation conta ined in th is m anual has been caref ully check ed and is believed to be acc urate; it is subject to c hange without n otice. Product ad vances mean that some s pecifications may have changed.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 6 1.5. Recycling Infor mation All c omponents within this product fulfill the requirem ents of the RoHS ( Restriction of Hazardous Substanc es Directive). The pro duct is sold ered with a lea d free proc ess.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 7 1.8. Explanation of Symbols CE Conformity This symbol indica tes that the pro duct desc ribed in this man ual is in compl iance with all ap- plied CE standards.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 8 1.9. Applicable Doc uments and Sta ndards The following pub lications are us ed in conjunction with this m anual. W hen an y of the referenced s pecifica- tions are supers eded b y an appro ved re vision, th at re vision shall appl y.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 9 Smart Batter y Data Specific ation Revision 1.1, December 11, 1998. www.sbs -forum .org System Managem ent Bus ( SMBus) S pecification V ersion 2 .0, August 3, 2000 C opyright © 1 994, 1995 , 1998, 2000 Duracell, Inc.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 10 RoHS is often refer red to as the "lead-free" direc tive but it r estricts the us e of the f ollowing substances : Lead Mercury Cadmium Chromium VI PBB and PBDE The m aximum allowable c oncentration of an y of the above m entioned substanc es is 0.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 11 1.12. Swiss Qualit y 100% Made in Switzerland DIGITAL-LOG IC is a mem ber of "Swiss- Label" This product was not m .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 12 2. O VERVIEW 2.1. Standard Feat ures of the MSB9 00/L The MICRO SPACE 3.5”-SBC is a m iniaturized m odular device incorp orating the m ajor elem ents of a PC/AT compatible com puter.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 13 2.3. MSB900 Block Diagram.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 14 2.4. MSB900/MSB90 0L specificatio ns CPU Specification CPU GEODE LX900 CPU Core Sup ply 1.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 15 Mass Storage Specification FD Floppy disk interface not support ed HD E-IDE interfac e, AT-t ype, for max. 2 hard disk s, 44pin connector, for 1.3, 1.8 and 2. 5" hard disk with 44 pins ID E Standard A T In terfaces: Specification Name FIFO IRQs Addr.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 16 Operating Environm ent Specification Relative hum idity 5-90%, non-condens ing Vibration 5-2000Hz, 0.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 17 2.7. Dimensions & D iagrams 2.7.1. MSB900/L Board / Version Unit: Tolerance: Date / Author MSB900/L mm (m illimeter) + / - 0.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 18.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 19.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 20.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 21 2.7.2. MSB800CON Part Nr 802205 Board / Version Unit: Tolerance: Date / Author MSB800CON mm (m illimeter) + / - 0.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 22 2.8. MSB900/L Incompa tibilities to a standard PC/ AT None. 2.9. Related A pplica tion Notes Application Notes are available at http: //www.digitallog ic.com sup port, or on an y DIG IT AL-LOGIC Application CD.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 23 2.11. Battery-Lifetime Battery specs: Lowest t emp. -40° C Nominal temp. +20° C Highest temp. +85° C Manufacturer: pba T y pe: ER10280 Capacity versus T em p: 10 uA 420mAh 400mAh 350m Ah Voltage versus T emp.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 24 4. BIOS H IST OR Y This BIOS histor y is for the MS B900/L. This BIOS histor y is not f or the follow ing product s: MSEP900, MSM9 00, SM900 Version: D ate: Status: Modification s: 1.23 02.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 25 5. D ET A ILED S YS TEM D ESCRIPT ION This s ystem configuration i s based on the I SA architec ture. Check the I/O and m em ory m ap in this chapter. 5.1. Power Require ments The power is conn ected thr ough t he wide-ra nge power c onnector.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 26 5.3. CPU, Boards a nd R A Ms 5.3.1. CPUs of this MICROSPA CE Product Processor: T ype: Clock: GEODE LX900 Nationa l 600 MHz 5.3.2. Numeric Cop rocessor It is integrated in th e LX900 CPU. 5.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 27 5.4.3. Serial Ports CO M1-COM2 The s erial chan nels are f ully com patible with 16C 550 UARTS. CO M1 is the primar y serial port, and is sup- ported by the boar d's ROM-BIOS as the PC-DO S 'COM1' device.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 28 5.6. Timers and Co unters 5.6.1. Programmable Timers An 8253 compatible t imer/c ounter device is also i ncluded in the boar d's ASIC de vice. This device is ut ilized in precisel y the sam e manner as in a standard AT implementation.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 29 5.6.4.1. Standard BIOS RO M Device: F W H Map: E0000 - FFFFFh Core BIOS 128k C0000 - C7FFFh VGA BIOS 32k CC000 - CFFFF h FR EE 5.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 30 CMOS Map Location Desc ription 00h Time of day (seconds) specified in BCD 01h Alarm (seconds) specified in BCD 02h Time of day (minutes) .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 31 CMOS Map continued... Location Description 0Eh CMOS Location for Bad CMOS and Checksum Flags Bit 7 = Flag for CMOS Lost Power 0 = Pow er .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 32 CMOS Map continued... Location Description 15h Base Memory Size (in kB) - Low Byte 16h Base Memory Size (in kB) - High Byte 17h Extended .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 33 CMOS Map continued... Location Description 22h Byte 3 Bits 7-6 = Res erved Bits 5-0 = Upp er 6 bits of Write Precompensation 23h Byte 4 B.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 34 CMOS Map continued... Location Description 33h Base Memory Installed Bit 7 = Flag for Memory Size 0 = 640kB 1 = 512kB Bits 6-0 = Res erved 34h M inor CPU Revision Differentiates CPUs within a CP U type (i.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 35 5.8.1. EEPROM Memory for Setup The EEPROM is used for setup and configurat ion data, stored as an alternative to the CMOS-RT C.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 36 5.9.2. System I/O map The f ollowing table deta ils the legac y I/O range f or 000h t hrough 4FFh. Each I/ O location has a read/ write (R/W) capability. Note the follow ing abbrev iations: --- Unknown or can not be determ ined.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 37 I/O Map Continued… I/O Addr. Function Size R/W Comment If KEL Memory Offset 100h[0] = 1(Emulation- Enabled bit). 060h Keyboard/Mouse - Data Port 8bit Yes If MSR 5140001Fh[0] = 1 (SNOOP bit) and KEL Memory Offset 100h[0] = 0 (Emulation- Enabled bit).
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 38 I/O Map Continued… I/O Addr. Function Size R/W Comment 0CCh Master DMA Address - Channel 7 8bit Yes 16 bit values in two transfers. 0CDh No Specific Usage 8bit --- 0CEh Master DMA Counter - Channel 7 8bit Yes 16bit values in two trans fers.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 39 I/O Map Continued… I/O Addr. Function Size R/W Comment 3F1h Flop py Status R B 8bit RO Firs t Floppy. 3F2h Flop py Digital Out 8bit Shw@ First Floppy. 3F3h No Specific Us age 8bit --- 3F4h Flop py Cntrl Status 8bit RO Fi rst Floppy.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 40 6. VGA 6.1. VGA/LCD Contr oller of the Ge ode LX90 0 • Highly integrated flat panel and CRT G UI Accelerator & Multim edia Engine, .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 41 7. V IDEO I NPUT The MSB900 co ntains a low-cost video input p ort. It c onsist of LX900’s video input port ( VIP) a nd t he exter- nal fram e grabber chip SA A7111A. T his port is capab le of digitizing a C VBS video signal with 15 fram es per second at a resolution of 352x288bits.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 42 Top view of the MSB900/L.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 43 Bottom v iew of the M SB900/L.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 44 X1 P ower Suppl y Pin Signal 1 (Shield) Po wer suppl y 8-30V 2 NC 3 Power su pply GND X14 Video IN Pin Si gnal Pin Signal 1 CVB S 2 G ND.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 45 X15 O perator Panel / Flat Panel (bo ttom side) X15 is intend ed t o be used internally to at tach an operator panel. Som e signals may not be present or are shared with ot her connect ors .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 46 X15 Rev erse Pin Con figuration MSB900 LVD S X15 (on com ponent side) Attention! W hen X15 is soldered on t he com ponent side, a diff erent pin num bering schem a must be applied. Odd and even pin numbers are swapped.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 47 X31 Ke yboard PS/2 and Mo use Utility Connector Connector and Adapter Mini- DIN PS/2 (6 PC) Remar ks Shield S hield KEYBOARD DATA 1 GND 3.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 48 X39 Serial Port COM 2 Header onboard D-SUB conn ector Signal Pin 1 Pin 1 DCD Pin 2 Pin 6 DSR Pin 3 Pin 2 RxD Pin 4 Pin 7 RTS Pin 5 Pin 3 .
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 49 X52 USB UDO C (not assembled ) Pin Si gnal Pin Signal 1 VCC 6 NC 2 NC 7 GND 3 USB- P2- 8 NC 4 NC 9 NC 5 USB- P2+ 10 NC Attention! X52 f or USB-DOC-F lash drives are only for OEM use. T he connector is not assem bled.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 50 X61 Serial Port COM 1, Parallel Port L PT1 Header onboard D-SUB conn ector Signal Pin 1 Pin 1 DCD Pin 2 Pin 6 DSR Pin 3 Pin 2 RxD Pin 4 P.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 51 X101 PCI-104 BU S Interface Pin A B C D 1 GND/5.0V KEY2 Reserve d +5 AD00 2 VI/O AD02 AD01 +5V 3 AD05 GND AD04 AD03 4 C/BE0* AD07 GND AD06 5 GND AD09 AD08 GND 6 AD11 VI/O AD10 M66EN 7 AD14 AD13 G ND AD12 8 +3.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 52 X230 JT A G-Port Pin Si gnal Pin Signal 1 T CK 2 T MS 3 T DI 4 T DO X301 VG A Monitor (CRT- Signals) 15pins High-Den sity DSub Pin Signal.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 53 9. J UMPER L OC A TIONS ON THE B O ARD The f ollowing f igure s hows the location of a ll jum per blocks on the MS B900/L board. T he num bers shown in this figure are silk screened on the board s o that the pins can easil y be located.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 54.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 55 10. C A BLE I NTERF ACES 10.1. The Hard Disk Cable 44pin IDT Term inal for Dual Row (2.00mm grid) and 1.00mm flat cable; 44p ins = 40pins signal and 4pins power. 1 1 2 43 43 44 44 39 39 40 40 2 Max.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 56 10.2. The COM1/LPT Ser ial Interface Cable Term inal for dual row 2mm grid and 1mm flat cable.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 57 10.3. The COM2 Seria l Interface Ca ble DT term inal for dual row 0.1" (2. 54mm grid) and 1.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 58 11. T HERM A L S PECIFIC A TIONS 11.1. Thermal Analysis for Case Inte gration The MSB900/L h as a uniqu e thermal design.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 59 12. A SSEMBL Y V IEWS 12.1. MSB900/L.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 60.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 61 12.2. Mechanical Dim ensions MSB900 Version Unit: mm (millimeter) Tolerance: +/- 0.1mm Date: 28.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 62 13. PXE-B OOT AND PXE-S ETUP IN THE BIOS PXE Protocol PXE is defined on a f oundation of industr y-standard Internet protocols and ser vices that are widely d eplo yed in the industr y, nam ely TCP/IP, D HCP, and TF TP.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 63 BIOS-Setup Scre en with the LA N-BOOT (PXE) DISABLE / EN ABLE m enu: After ENABLING th e LAN- Boot, the Pass word m ust be entered. The Password m ust be req uested with the PX E-licence order f orm on the following pa ge.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 64 14. PXE-L ICENSE O RDER The PXE-Function must be license d before it can be enabled. T o order, fill out and s ign this form ; r eturn to the fax number below. T his f orm m ay be printed out separatel y f rom the digita l c opy of this manual on the Product CD.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 65 15. I NDEX 1 10/100 BASE-T Interface 47 A Addressing PCI D evices 23 Application Notes 16, 2 2 B Battery-Lifetim e 23 BIOS CMOS 29 BIOS H.
DIGITAL-LOGIC AG M SB900/L Detailed T echnical M anual V1.0 66 RoHS Comm itment 9 ROM-BIOS 28 RTC 28 S Safety Precautions 9 Schematics 59 Serial Interface Ca ble 56, 5 7 Serial Port COM1 50 Serial Por.
Un point important après l'achat de l'appareil (ou même avant l'achat) est de lire le manuel d'utilisation. Nous devons le faire pour quelques raisons simples:
Si vous n'avez pas encore acheté Compaq MSB900 c'est un bon moment pour vous familiariser avec les données de base sur le produit. Consulter d'abord les pages initiales du manuel d'utilisation, que vous trouverez ci-dessus. Vous devriez y trouver les données techniques les plus importants du Compaq MSB900 - de cette manière, vous pouvez vérifier si l'équipement répond à vos besoins. Explorant les pages suivantes du manuel d'utilisation Compaq MSB900, vous apprendrez toutes les caractéristiques du produit et des informations sur son fonctionnement. Les informations sur le Compaq MSB900 va certainement vous aider à prendre une décision concernant l'achat.
Dans une situation où vous avez déjà le Compaq MSB900, mais vous avez pas encore lu le manuel d'utilisation, vous devez le faire pour les raisons décrites ci-dessus,. Vous saurez alors si vous avez correctement utilisé les fonctions disponibles, et si vous avez commis des erreurs qui peuvent réduire la durée de vie du Compaq MSB900.
Cependant, l'un des rôles les plus importants pour l'utilisateur joués par les manuels d'utilisateur est d'aider à résoudre les problèmes concernant le Compaq MSB900. Presque toujours, vous y trouverez Troubleshooting, soit les pannes et les défaillances les plus fréquentes de l'apparei Compaq MSB900 ainsi que les instructions sur la façon de les résoudre. Même si vous ne parvenez pas à résoudre le problème, le manuel d‘utilisation va vous montrer le chemin d'une nouvelle procédure – le contact avec le centre de service à la clientèle ou le service le plus proche.
